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Bluetooth Embedded Module (Class 1): Serial & Audio
Serial Modules
1. Serial Modules: FB755AS/AC
   
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1:7 Multi-serial Embedded module
Enabling multi-serial communications wirelessly. Simultaneous multi-serial communications between 1 point and
7 different points.
AT commands and GUI tools are provided for easier settings on customers' side.
Starter's kit is available. 

Ordering Info.:
FB755AS: Class 1, w/ Stack & External Antenna
FB755AC: Class 1, w/ Stack & Chip Antenna
* Piconets(point to multipoint) are configurable up to (Max 1:7)
Certifications Finished:

Certifications Under Progress:

DOWNLOAD

FB755AS User Guide version 1.0 Manual
Detailed Description on PC configuration Appendix A
AT Commands Set Guide Appendix B
1:N multi-serial Data Communications Appendix C
FB200AS Installation Device Driver Appendix D
¡á Specifications
 Specification  2.0
 Profile  GAP, SPP
 Carrier Frequency  2.4GHz ISM Band
 Receiving Signal Range  -83dBm (Typical)
 Transmission Power  16dBm (Typical)
 Power Consumption  Max 100mA
 Supply voltage  3.3VDC +/-0.2
 Power Class  Class1 (100m)
 Size  27.7 x 20.6 mm
 Data Rate  2,400 ~ 230,400 bps
 Operation Temperature  -20¡É ~ 70¡É
 Antenna Type  Chip or External Antenna
 Output Interface  UART (TTL level)
¡á Pin Description

Pin NO.
Name of Signal
Feature
Signal Level
Input Output Direction
1
STATUS
 STATUS LED
TTL
Output
2
FA SET
 Factory Reset
TTL
Input
3
STREAM CONTROL
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 1:N - Stream Control
TTL
Input
DSR  1:1 - Data Set Ready
4
STREAM STATUS
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 1:N - Stream Status
TTL
Output
DTR  1:1 - Data Terminal Ready
5
CONFIG SELECT
 PC Configuration Select
TTL
Input
6
CONNECT CHECK
 1:N - Connect Check
TTL
Output
DCD  1:1 - Data Carrier Detect
7
GND
 Ground
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8
TXD
 Transfer Data
TTL
Output
9
RXD
 Received Data
TTL
Input
10
MESSAGE CONTROL
 1:N - Message Control
TTL
Input
CTS  1:1 - Clear To Send
11
MESSAGE STATUS
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 1:N - Message Status
TTL
Output
RTS  1:1 - Ready To Send
12
VCC
 3.3V DC
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Input
¡á Pin Connection

 - With Flow Control
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 - Without Flow Control

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 - 1:N Communication




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Audio Modules
2. Audio Modules: FB570AC

   

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Audio Embedded module
Bluetooth Audio module for Audio Applications such as Bluetooth Headsets, Handsfree, other Audio devices

Ordering Info.:
FB570AC: Class 1, w/ Stack & Chip Ant.
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 Specification  2.0
 Profile
 HSP,HFP,HFPAG,A2DP,SPP,AVRCP
 Carrier Frequency  2.4GHz ISM Band
 Receiving Signal Range  -83dBm (Typical)
 Transmission Power  16dBm (Typical)
 Power Consumption  Max 100mA
 Supply voltage  3.3VDC +/-0.2
 Power Class  Class1 (100m)
 Size  27.7 x 20.6 mm
 Data Rate  2,400 ~ 230,400 bps
 Operation Temperature  -20¡É ~ 70¡É
 Antenna Type  Chip Antenna


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